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Showing posts with the label Global Thermal Interface Materials Market

Thermal Interface Materials with efficient heat transferring function and enhance heat conductivity: Tremendous Growth in the IT sector: Asia Pacific Market Forecast 2015 - 2023

Thermal interface materials (TIM) are materials with high thermal conductivity, which act as an interface between the heat sink and the heat source. The heat sink removes heat from heat source with the help of thermal interface materials. The process involves removal of heat and release into the ambient environment by replacing the thermally insulating air between two surfaces. Thermal interface materials possess some key properties, such as high thermal conductivity, minimum thickness, and no leakage from the interface, which help them to deliver high thermal performance. Moreover, they add mechanical strength to the interface between the heat sink and heat source. Thermal interface materials remove the interstitial air or gap from the junction which acts as an insulator. They increase the conduction of heat between the surfaces in various electronic equipments. In order to eliminate overheating in electronic equipment, they increase the conductivity of heat between a hot comp...